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1SD536F2 数据表(PDF) 4 Page - Power Integrations, Inc. |
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1SD536F2 数据表(HTML) 4 Page - Power Integrations, Inc. |
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4 / 11 page ![]() 4 www.power.com 2SMLT0220D2I0C Rev. A 04/25 Advanced Active Clamping (AAC) Active clamping is a technique designed to partially turn on the power semiconductor in case the drain-source voltage exceeds a predefined threshold. The power semiconductor is then kept in linear operation. Figure 4 illustrates the general behavior of active clamping and its voltage thresholds. Basic active clamping topologies implement a single feedback path from the power semiconductor collector/drain through transient voltage suppressor (TVS) diodes to the power semiconductor gate. The gate driver contains Power Integrations’ Advanced Active Clamping (AAC) based on this principle: When active clamping is activated, the turn-off MOSFET of the gate driver is switched off in order to improve the effectiveness of the active clamping and to reduce the losses in the TVS diodes. This feature is mainly integrated in the secondary-side ASIC of the gate driver. To ensure that the gate-source voltage stays close to the nominal turn- on voltage each MAG features a gate-clamping circuitry. The gate clamping provides a voltage similar to V VISO to the gate, i.e. 15 V. As the effective short-circuit current is a function of the gate- source voltage the short-circuit current is limited. As consequence, the energy dissipated in the power semiconductor during the short-circuit event is reduced, leading to a junction temperature within the short- circuit safe operating area (SCSOA) limits and enables a safe turn-off of the device. It should be noted that AAC should not be activated during regular operation to avoid excessive heating of the transient voltage suppressor diodes. Conformal Coating The electronic components of the gate driver are protected by a layer of acrylic conformal coating with a typical thickness of 50µm using ELPEGUARD SL 1307 FLZ/2 from Lackwerke Peters on both sides of the PCB. This coating layer increases the product reliability when exposed to contaminated environments. Figure 4. Advanced Active Clamping V IGBT with AAC without AAC V TVS V DC I Load v CE i C PIHPAE_0046 t |
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