INA128-HT, INA129-HT

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SBOS501F – JANUARY 2010 – REVISED FEBRUARY 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply

±18

Volttage

V

Analog input

±40

Current

Output short-circuit (to ground)

Continuous

HKJ, HKQ, KGD and JD packages

–55

210

Operating temperature

°C

D package

–55

175

HKJ, HKQ, KGD and JD packages

–55

210

Storage temperature, Tstg

°C

D package

–55

175

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

A. INA218-HT (D, HKJ, or JDJ Package)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±50

C101(2)

B. INA129-HT (HKQ Package)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±4000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±200

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V power supply

±2.25

±15

±18

V

Input common-mode voltage range for VO = 0

V - 2 V

V + –2 V

TA operating temperature INA128-HT

–55

175

°C

TA operating temperature INA129-HT

–55

210

°C

7.4 Thermal Information: INA128-HT

INA128-HT

THERMAL METRIC(1)

D [SOIC]

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

110

RθJC(top)

Junction-to-case (top) thermal resistance

57

RθJB

Junction-to-board thermal resistance

54

°C/W

ψJT

Junction-to-top characterization parameter

11

ψJB

Junction-to-board characterization parameter

53

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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