6

LMV712-N, LMV712-N-Q1

SNOS534J – FEBRUARY 2001 – REVISED NOVEMBER 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

Shorting circuit output to either V+ or V− adversely affects reliability.

(4)

The maximum power dissipation is a function of TJ(MAX) and RθJA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential input voltage

±Supply voltage

Voltage at input or output pin

(V+) + 0.4

(V–) – 0.4

V

Supply voltage (V+ – V–)

6

V

V+, V–

Output short circuit

See(3)

Current at input pin

±10

mA

Current at output pin

±50

mA

TJMAX

Junction temperature(4)

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±150

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.7

5.5

V

Operating temperature

LMV712

–40

85

°C

LMV712-Q1

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LMV712-N, LMV712-N-Q1

UNIT

YPA (DSBGA)

NGY (WSON)

DGS (VSSOP)

10 PINS

10 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

84.1

70

176.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.6

74.7

67.5

°C/W

RθJB

Junction-to-board thermal resistance

21.4

43.7

97.2

°C/W

ψJT

Junction-to-top characterization parameter

2.2

2

9.4

°C/W

ψJB

Junction-to-board characterization parameter

21.3

43.7

95.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

11.8

—

°C/W