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PACKAGE OUTLINE

C

24X

0.3

0.2

2.4 0.1

24X

0.5

0.3

0.8 MAX

NOTE 4

SOLDER BUMP

0.110

0.035

20X 0.5

2X

3

2X 2

3.4 0.1

B

4.1

3.9

A

5.1

4.9

(0.2) TYP

WQFN - 0.8 mm max height

NJA0024A

PLASTIC QUAD FLATPACK - NO LEAD

4215212/A 04/2017

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

7

13

19

8

12

24

20

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

25

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

4. Package maximum height does not include the solder bump height.

SCALE 2.800