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LP5521TMX/NOPB 数据表(PDF) 2 Page - Texas Instruments |
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LP5521TMX/NOPB 数据表(HTML) 2 Page - Texas Instruments |
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2 / 51 page ![]() 2 LP5521 SNVS441I – JANUARY 2007 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: LP5521 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5 6.1 Absolute Maximum Ratings ..................................... 5 6.2 ESD Ratings.............................................................. 5 6.3 Recommended Operating Conditions ....................... 5 6.4 Thermal Information .................................................. 6 6.5 Electrical Characteristics........................................... 6 6.6 Charge Pump Electrical Characteristics ................... 7 6.7 LED Driver Electrical Characteristics (R, G, B Outputs) ..................................................................... 7 6.8 Logic Interface Characteristics.................................. 7 6.9 I2C Timing Requirements (SDA, SCL)...................... 8 6.10 Typical Characteristics ............................................ 9 7 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 7.3 Feature Description................................................. 12 7.4 Device Functional Modes........................................ 18 7.5 Programming........................................................... 19 7.6 Register Maps ......................................................... 28 8 Application and Implementation ........................ 36 8.1 Application Information............................................ 36 8.2 Typical Applications ................................................ 36 8.3 Initialization Setup ................................................... 39 9 Power Supply Recommendations ...................... 40 10 Layout................................................................... 40 10.1 Layout Guidelines ................................................. 40 10.2 Layout Example .................................................... 40 11 Device and Documentation Support ................. 41 11.1 Device Support...................................................... 41 11.2 Documentation Support ........................................ 41 11.3 Receiving Notification of Documentation Updates 41 11.4 Community Resources.......................................... 41 11.5 Trademarks ........................................................... 41 11.6 Electrostatic Discharge Caution ............................ 41 11.7 Glossary ................................................................ 41 12 Mechanical, Packaging, and Orderable Information ........................................................... 41 4 Revision History Changes from Revision H (May 2016) to Revision I Page • Changed wording of title ........................................................................................................................................................ 1 Changes from Revision G (September 2014) to Revision H Page • Added several new Applications ............................................................................................................................................ 1 • Changed Body Size of DSBGA package to MAX dimensions .............................................................................................. 1 • Changed Handling Ratings to ESD Ratings table ................................................................................................................. 5 • Changed RθJA value for DSBGA from 50 – 90°C/W to 70.7°C/W and WQFN from 37 – 90°C/W to 38.4°C/W; add additional thermal information ................................................................................................................................................ 6 • Added Community Resources ............................................................................................................................................. 41 Changes from Revision F (February 2013) to Revision G Page • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................................... 1 |
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