4

LPV801, LPV802

SNOSCZ3B – AUGUST 2016 – REVISED NOVEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Not to exceed -0.3V or +6.0V on ANY pin, referred to V-

(3)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should

be current-limited to 10 mA or less.

(4)

Short-circuit to Vs/2, one amplifer per package. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, Vs = (V+) - (V-)

–0.3

6

V

Input pins

Voltage (2) (3)

Common mode

(V-) - 0.3

(V+) + 0.3

V

Differential

(V-) - 0.3

(V+) + 0.3

V

Input pins

Current

-10

10

mA

Output short

current (4)

Continuous

Continuous

Operating temperature

–40

125

°C

Storage temperature, Tstg

–65

150

°C

Junction temperature

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (V+ – V–)

1.6

5.5

V

Specified temperature

-40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LPV801

DBV (SOT-23)

5 PINS

LPV802

DGK

(VSSOP)

8 PINS

UNIT

θJA

Junction-to-ambient thermal resistance

177.4

184.2

ºC/W

θJCtop

Junction-to-case (top) thermal resistance

133.9

75.3

θJB

Junction-to-board thermal resistance

36.3

105.5

ψJT

Junction-to-top characterization parameter

23.6

13.5

ψJB

Junction-to-board characterization parameter

35.7

103.9