Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Description (continued).................................................. 3

6 Pin Configuration and Functions...................................3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings........................................ 4

7.2 ESD Ratings............................................................... 4

7.3 Recommended Operating Conditions.........................4

7.4 Thermal Information....................................................5

7.5 Supply Current............................................................ 5

7.6 Internal 1.8-V LDO (REG18).......................................5

7.7 I/O (PULS, INT)...........................................................5

7.8 Chip Enable (CE)........................................................ 5

7.9 Internal Temperature Sensor...................................... 6

7.10 NTC Thermistor Measurement Support....................6

7.11 Coulomb Counter (CC)............................................. 6

7.12 Analog Digital Converter (ADC)................................ 6

7.13 Internal Oscillator Specifications...............................7

7.14 Voltage Reference1 (REF1)......................................7

7.15 Voltage Reference2 (REF2)......................................7

7.16 Flash Memory........................................................... 7

7.17 I2C I/O....................................................................... 7

7.18 I2C Timing — 100 kHz.............................................. 8

7.19 I2C Timing — 400 kHz.............................................. 8

7.20 HDQ Timing.............................................................. 8

7.21 Typical Characteristics............................................ 10

8 Detailed Description...................................................... 11

8.1 Overview................................................................... 11

8.2 Functional Block Diagram......................................... 11

8.3 Feature Description...................................................11

8.4 Device Functional Modes..........................................13

9 Applications and Implementation................................ 14

9.1 Application Information............................................. 14

9.2 Typical Applications.................................................. 15

9.3 Power Supply Recommendations.............................18

9.4 Layout....................................................................... 18

10 Device and Documentation Support..........................20

10.1 Device Support....................................................... 20

10.2 Documentation Support.......................................... 20

10.3 Receiving Notification of Documentation Updates..20

10.4 Support Resources................................................. 20

10.5 Trademarks.............................................................20

10.6 Electrostatic Discharge Caution..............................20

10.7 Glossary..................................................................20

11 Mechanical, Packaging, and Orderable

Information.................................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (November 2021) to Revision B (November 2022)

Page

• Removed the CE reference in this section; added a new, separate section for CE........................................... 5

• Added the Chip Enable (CE) section for the CE pin thresholds that are assured by design.............................. 5

Changes from Revision * (February 2020) to Revision A (November 2021)

Page

• Changed the body size in Device Information ................................................................................................... 1

BQ27Z561-R2

SLUSE22B – FEBRUARY 2020 – REVISED NOVEMBER 2022

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