CC2591

www.ti.com

SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014

Electrical Characteristics (continued)

TC = 25°C, VDD = 3 V , fRF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external

matching components.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Gain variation, -40°C – 85°C, High-Gain

HGM = 1

3

dB

Mode

HGM = 1, including internal T/R switch and external

Noise figure, High-Gain Mode

4.8

dB

antenna match

Input 1-dB compression, High-Gain Mode

HGM = 1

–17

dBm

Input IP3, High-Gain Mode

HGM = 1

–2

dBm

Input reflection coefficient, S11

HGM = 1, measured at antenna port

–11

dB

RF Transmit

Gain

22

dB

Output power, POUT

PIN = 0.5 dBm

20.6

dBm

Maximum output power

PIN = 5 dBm

22

dBm

Power Added Efficiency, PAE

PIN = 0.5 dBm

34%

Output 1-dB compression

19

dBm

Output IP3

32

dBm

Output power variation over frequency

2400 – 2483.5 MHz, PIN = 0.5 dBm

0.5

dB

Output power variation over power supply

2 V – 3.6 V , PIN = 0.5 dBm

3.5

dB

Output power variation over temperature

-40°C – 85°C, PIN = 0.5 dBm

1.5

dB

PIN = 0.5 dBm. The second harmonic can be reduced

Second harmonic power

to below regulatory limits by using an external LC filter

–15

dBm

and antenna.

PIN = 0.5 dBm. The third harmonic can be reduced to

Third harmonic power

below regulatory limits by using an external LC filter

–30

dBm

and antenna.

4.5

Thermal Resistance Characteristics for RGV Package

NAME

DESCRIPTION

°C/W(1) (2)

AIR FLOW (m/s)(3)

R

ΘJC-top

Junction-to-case (top)

52.8

0.00

R

ΘJB

Junction-to-board

20.4

0.00

R

ΘJA

Junction-to-free air

41.9

0.00

PsiJT

Junction-to-package top

1.4

0.00

PsiJB

Junction-to-board

20.5

0.00

R

ΘJC-bottom

Junction-to-case (bottom)

8.3

0.00

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

ΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(3)

m/s = meters per second.

Copyright © 2008–2014, Texas Instruments Incorporated

Specifications

7

Submit Documentation Feedback

Product Folder Links: CC2591