数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

ESDS312DBVR.B 数据表(PDF) 10 Page - Texas Instruments

部件名 ESDS312DBVR.B
功能描述  ESDS31x Data-Line Surge and ESD Protection Diode Array
PDF  23 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

ESDS312DBVR.B 数据表(HTML) 10 Page - Texas Instruments

Back Button ESDS312DBVR.B Datasheet HTML 6Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 7Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 8Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 9Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 10Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 11Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 12Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 13Page - Texas Instruments ESDS312DBVR.B Datasheet HTML 14Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 10 / 23 page
background image
7.2.2 Detailed Design Procedure
7.2.2.1 Signal Range
The ESDS314 has 4 identical surge protection channels with each channel supporting a signal range of 0 to
3.6V. The device will work well with any Ethernet PHY that drives the single ended voltage on the data line up to
a 3.6V.
7.2.2.2 Operating Frequency
The ESDS314 has a capacitance of 4.5pF (typical) and can support the 125MHz operation of Ethernet
1000Base-T application
7.2.3 Application Curves
D012_S21.grf
Frequency (GHz)
0.1
0.2
0.3
0.4 0.5 0.60.7
1
2
-12
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
D012
Figure 7-2. Differential Insertion Loss vs. Frequency
7.3 Power Supply Recommendations
The ESDS314, ESDS312 devices are passive ESD devices and there is no need to power it. Take care not to
violate the recommended I/O specification (0 V to 3.6 V) to ensure the device functions properly.
7.4 Layout
7.4.1 Layout Guidelines
• The optimum placement is as close to the connector as possible.
– EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,
resulting in early system failures.
– The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away
from the protected traces which are between the TVS and the connector.
• Route the protected traces as straight as possible.
• Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded
corners with the largest radii possible.
– Electric fields tend to build up on corners, increasing EMI coupling.
ESDS311, ESDS312, ESDS314
SLVSEG9C – MAY 2018 – REVISED FEBRUARY 2024
www.ti.com
10
Submit Document Feedback
Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: ESDS311 ESDS312 ESDS314



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com