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ESDS312 数据表(PDF) 14 Page - Texas Instruments

部件名 ESDS312
功能描述  ESDS31x Data-Line Surge and ESD Protection Diode Array
PDF  23 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

ESDS312 数据表(HTML) 14 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
20-May-2025
PACKAGING INFORMATION
Orderable part number
Status
(1)
Material type
(2)
Package | Pins
Package qty | Carrier
RoHS
(3)
Lead finish/
Ball material
(4)
MSL rating/
Peak reflow
(5)
Op temp (°C)
Part marking
(6)
ESDS311DYFR
Active
Production
SOT (DYF) | 2
3000 | LARGE T&R
Yes
SN
Level-3-260C-168 HR
-40 to 125
37OF
ESDS312DBVR
Active
Production
SOT-23 (DBV) | 5
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
1R4B
ESDS314DBVR
Active
Production
SOT-23 (DBV) | 5
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
1R2B
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1



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