5.5 Thermal Information (continued)

THERMAL METRIC (1)

ESDS311

ESDS312

ESDS314

UNIT

DYF (SOD323)

DBV (SOT-23)

DBV (SOT-23)

2 PINS

5 PINS

5 PINS

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Electrical Characteristics

At TA = 25°C unless otherwise noted

PARAMETER

TEST CONDITIONS

Device

MIN

TYP

MAX

UNIT

VRWM

Reverse stand-off voltage

IIO < 500nA, across operating

temperature range

3.6

V

ILEAKAGE

Leakage current at 3.6V

VIO = 3.6V, Any IO pin to GND

5

50

nA

VBRF

Breakdown voltage, IO to GND (1) IIO = 1mA

4.5

7.5

V

VFWD

Forward Voltage, GND to IO

IIO = 1mA

0.8

V

VHOLD

Holding Voltage, IO to GND (2)

IIO = 1mA

5

V

VCLAMP

Surge Clamping voltage, tp =

8/20µs

IPP = 1A, Any IO pin to GND

ESDS312/314

5

V

VCLAMP

IPP = 12A, Any IO pin to GND

ESDS311

6.3

V

ESDS312/314

5.6

VCLAMP

IPP = 25A, Any IO pin to GND

ESDS311

7.7

V

ESDS312/314

6.5

VCLAMP

IPP = 1A, GND to any IO pin

ESDS312/314

1

V

VCLAMP

IPP = 12A, GND to any IO pin

ESDS311

3

V

ESDS312/314

2.1

VCLAMP

IPP = 25A, GND to any IO pin

ESDS311

4.9

V

ESDS312/314

3.6

VCLAMP

TLP Clamping Voltage, tp =

100ns

IPP = 16A, Any IO pin to GND

ESDS311

6.5

V

ESDS312/314

5.5

VCLAMP

IPP = 16A, GND to any IO pin

ESDS311

3.4

V

ESDS312/314

2.2

CLINE

Line capacitance, Any IO to GND VIO = 0V, Vp-p = 30mV, f = 1MHz

4.5

5.5

pF

ΔCLINE

Variation of line capacitance

CLINE1 - CLINE2, VIO = 0V, Vp-p =

30mV, f = 1MHz

ESDS312/314

0.05

0.1

pF

CCROSS

Line-to-line capacitance

VIO = 0V, Vrms = 30mV, f = 1MHz ESDS312/314

2.25

2.75

pF

(1)

VBRF and VBRR are defined as the voltage obtained at 1mA when sweeping the voltage up, before the device latches into the snapback

state

(2)

VHOLD is defined as the voltage when 1mA is applied, after the device has successfully latched into the snapback state.

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ESDS311, ESDS312, ESDS314

SLVSEG9C – MAY 2018 – REVISED FEBRUARY 2024

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