LP3995

SNVS179F – FEBRUARY 2003 – REVISED SEPTEMBER 2015

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Table of Contents

8.3

Feature Description................................................. 11

1

Features .................................................................. 1

8.4

Device Functional Modes........................................ 12

2

Applications ........................................................... 1

9

Application and Implementation ........................ 13

3

Description ............................................................. 1

9.1

Application Information............................................ 13

4

Revision History..................................................... 2

9.2

Typical Application ................................................. 13

5

Pin Configuration and Functions ......................... 3

10

Power Supply Recommendations ..................... 17

6

Specifications......................................................... 4

11

Layout................................................................... 17

6.1

Absolute Maximum Ratings ...................................... 4

11.1

Layout Guidelines ................................................. 17

6.2

ESD Ratings.............................................................. 4

11.2

Layout Examples................................................... 17

6.3

Recommended Operating Conditions ....................... 4

11.3

DSBGA Mounting.................................................. 18

6.4

Thermal Information .................................................. 5

11.4

DSBGA Light Sensitivity ....................................... 18

6.5

Electrical Characteristics........................................... 5

12

Device and Documentation Support ................. 19

6.6

Timing Requirements ................................................ 6

12.1

Documentation Support ........................................ 19

6.7

Typical Characteristics .............................................. 7

12.2

Community Resources.......................................... 19

7

Parameter Measurement Information ................ 10

12.3

Trademarks ........................................................... 19

7.1

Input Test Signals ................................................... 10

12.4

Electrostatic Discharge Caution ............................ 19

8

Detailed Description ............................................ 11

12.5

Glossary ................................................................ 19

8.1

Overview ................................................................. 11

13

Mechanical, Packaging, and Orderable

8.2

Functional Block Diagram ....................................... 11

Information ........................................................... 19

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (March 2013) to Revision F

Page

•

Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description,

Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and

Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1

•

Changed Thermal Values, ..................................................................................................................................................... 1

•

Deleted Lead Temp from Abs Max table (in POA); delete Heatsinking sections re: specific packages (outdated info) ....... 4

Changes from Revision D (March 2013) to Revision E

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 18

2

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