4

LPV511

SNOSAG7D – AUGUST 2005 – REVISED AUGUST 2016

www.ti.com

Product Folder Links: LPV511

Submit Documentation Feedback

Copyright © 2005–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Output short-circuit duration is infinite for V+ < 6 V at room temperature and below. For V+ > 6 V, allowable short-circuit duration is 1.5

ms.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN Differential

2.1

V

Supply voltage (V+ - V−)

13.2

V

Voltage at input and output pins

V+ + 0.3

V−

− 0.3

V

Short-circuit duration

See(3)

Junction temperature, TJ

(4)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model: 1.5 kΩ in series with 100 pF.

(3)

Machine Model: 0 Ω in series with 200 pF.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V

Machine model (MM)(3)

±200

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PC board.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature(1)

–40

85

°C

Supply voltage (V+ – V−)

2.7

12

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LPV511

UNIT

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

278

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

105.8

°C/W

RθJB

Junction-to-board thermal resistance

56.4

°C/W

ψJT

Junction-to-top characterization parameter

3

°C/W

ψJB

Junction-to-board characterization parameter

55

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W