PR01, PR02, PR03

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Revision: 07-Nov-17

1

Document Number: 28729

For technical questions, contact: filmresistorsleaded@vishay.com

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Power Metal Film Leaded Resistors

DESCRIPTION

A homogeneous film of metal alloy is deposited on a high

grade ceramic body. After a helical groove has been cut in

the resistive layer, tinned connecting wires of electrolytic

copper or copper-clad iron are welded to the end-caps. The

resistors are coated with a red, non-flammable lacquer

which

provides

electrical,

mechanical

and

climatic

protection. This coating is not resistant to aggressive fluxes

and cleaning solvents. The encapsulation is resistant to all

cleaning solvents in accordance with IEC 60068-2-45.

FEATURES

• High power in small packages (1 W / 0207 size

to 3 W / 0617 size)

• Defined fusing characteristics

• Technology: metal film

• Meets

active

and

passive

flammability

requirements as defined in IEC 60115-1

• AEC-Q200 qualified (PR01 and PR02)

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• All general purpose power applications

• Automotive electronics

• Lighting ballast

Notes

(1) R value is measured with probe distance of 24 mm ± 1 mm using 4-terminal method

(2) 1 % tolerance is available for Rn-range from 1  upwards

TECHNICAL SPECIFICATIONS

DESCRIPTION

PR01

PR02

Cu-lead

PR02

FeCu-lead

PR03

Cu-lead

PR03

FeCu-lead

DIN size

0207

0411

0411

0617

0617

Resistance range (1)

0.22

 to 1 M

0.33

 to 1 M

1

 to 1 M

0.68

 to 1 M

1

 to 1 M

Resistance tolerance (2)

± 1 %; ± 5 %

± 1 %; ± 5 %

± 1 %; ± 5 %

± 1 %; ± 5 %

± 1 %; ± 5 %

Temperature coefficient

± 250 ppm/K

± 250 ppm/K

± 250 ppm/K

± 250 ppm/K

± 250 ppm/K

Rated dissipation, P70

1

 R

1 W

2 W

1.3 W

3 W

2.5 W

R < 1



0.6 W

1.2 W

-

1.6 W

-

Thermal resistance (Rth)

135 K/W

75 K/W

115 K/W

60 K/W

75 K/W

Operating voltage, Umax. AC/DC

350 V

500 V

500 V

750 V

750 V

E-series

E24, E96 (± 1 %); E24 (± 5 %)

Basic specification

IEC 60115-1

Stability after:

Endurance test (1000 h, P70)

R max.: ± (5 % R + 0.1 )

Damp heat test (56 days)

R max.: ± (3 % R + 0.1 )

Soldering (10 s, 260 °C)

R max.: ± (1 % R + 0.05 )