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PUSB3AB4

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Product data sheet

Rev. 2 — 4 May 2016

9 of 13

Nexperia

PUSB3AB4

ESD protection for ultra high-speed interfaces

9.

Soldering

Fig 16. Reflow soldering footprint DFN2510A-10 (SOT1176-1)

SOT1176-1

Remark:

Stencil of 75 μm is recommended.

A stencil of 75 μm gives an aspect ratio of 0.77

With a stencil of 100 μm one will obtain an aspect ratio of 0.58

Footprint information for reflow soldering of DFN2510A-10 package

solder land plus solder paste

occupied area

solder land

solder paste deposit

solder resist

Hx

By

Hy

0.05

C

P

D

0.05

Ay

Dimensions in mm

Ay

By

C

D

Hy

1.25

0.3

0.475

0.2

P

0.5

1.5

Hx

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

sot1176-1_fr