TS2007FC datasheet(31/33 Pages) STMICROELECTRONICS

部件名	TS2007FC

功能描述	3 W, filter-free, class-D audio power amplifier with 6 or 12 dB fixed gain select

PDF	33 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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31 / 33 page

DocID14937 Rev 4

31/33

TS2007FC

Package information

5.1

9-bump Flip-chip package information

Figure 48. 9-bump Flip-chip package outline

Die size: 1.57 mm x 1.57 mm ±30 µm

Die height (including bumps): 600 µm

Bump diameter: 315 µm ±50 µm

Bump diameter before reflow: 300 µm ±10 µm

Bump height: 250 µm ±40 µm

Die height: 350 µm ±20 µm

Pitch: 500 µm ±50 µm

Back coating layer height (optional): 40 µm ±10 µm

Coplanarity: 50 µm max.

Figure 49. 9-bump Flip-chip marking (top view)

Logo: ST

First two digits for part number: 07

Third digit for assembly plant: X

Three digit date code: YWW

Dot indicates pin A1

“E” symbol for lead free

600µm

40µm

600µm

40µm

1.57 mm

0.5mm

∅ 0.25mm

1.57 mm

0.5mm

∅ 0.25mm

07 X

YWW

(1)

(2)

(3)

(4)

(5)

(6)

GAMS1312131712CB

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