Package information

TS2007

26/29

Doc ID 13123 Rev 4

5

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

ECOPACK® packages. These packages have a lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.

Figure 52.

Pinout (top view)

Figure 53.

Marking (top view)

Figure 54.

Recommended footprint for the TS2007 DFN8 package

1

2

3

4

8

7

6

5

1

2

3

4

8

7

6

5

Logo: ST

Part number: K007

Three digit date code: YWW

The dot is for marking pin 1

1.8 mm

0.8 mm

0.35 mm

0.65 mm

1.4 mm

2.2 mm

Obsolete

Product(s)

- Obsolete

Product(s)