Package information

TS2012

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DocID14236 Rev 2

5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

QFN20 package information

The QFN20 package has an exposed pad E2 x D2. For enhanced thermal performance, the

exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This

copper area can be electrically connected to pin 4, 12, 18 (PGND, AGND) or left floating.

Figure 47. QFN20 package mechanical drawing