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TS4909 数据表(PDF) 32 Page - STMicroelectronics |
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TS4909 数据表(HTML) 32 Page - STMicroelectronics |
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32 / 35 page ![]() Package information TS4909 32/35 Doc ID 11972 Rev 9 Note: The DFN10 package has an exposed pad E2 x D2. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This copper area can be electrically connected to pin 6 (GND) or left floating. Table 7. DFN10 3 x 3 pitch 0.5 mm exposed pad package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 0.031 0.035 0.040 A1 0.02 0.05 0.0008 0.002 A2 0.55 0.65 0.80 0.022 0.026 0.031 A3 0.20 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 D 2.85 3.00 3.15 0.112 0.118 0.124 D2 2.20 2.70 0.087 0.106 E 2.85 3.00 3.15 0.112 0.118 0.124 E2 1.40 1.75 0.055 0.069 e 0.50 0.020 L 0.30 0.40 0.50 0.012 0.016 0.020 ddd 0.08 0.003 |
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