TS4994

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, STMicroelectronics offers these devices in

ECOPACK® packages. These packages have a Lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.