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BYW29 数据表(PDF) 3 Page - STMicroelectronics |
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BYW29 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 6 page ![]() 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 20 40 60 80 100 120 140 160 T I M =tp/T tp IM(A) P=15W P=5W P=10W Fig.2 : Peak current versus form factor. Tj= 125 C o IFM(A) 0.1 1 10 100 VFM(V) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Fig.3 : Forward voltage drop versus forward current (maximum values). 0.1 1.0 0.2 0.5 Zth(j-c) (tp. ) K= Rth(j-c) =0 . 5 =0 . 2 =0 .1 Singl e puls e tp(s) T =tp/T tp 1.0E-03 1.0E-02 1.0E-01 1. 0E+00 K Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration. (TO-220AC) 012 345 678 9 10 11 0 2 4 6 8 10 12 =0.05 =0.1 =0.2 =0.5 T =tp/T tp IF(av)(A) PF(av)(W) =1 Fig.1 : Average forward power dissipation versus average forward current. 0.2 0.4 0.6 0.8 1 =0 . 5 =0 .2 =0 .1 Single pulse tp(s) Zth(j-c) (tp. ) K= Rth(j-c) 0 1.0E-03 1.0E-02 1.0E-01 1.0 E+00 1. 0E+01 K T =tp/T tp Fig.5 : Relative variation of thermal impedance junction to case versus pulse duration. (ISOWATT220AC) BYW29(F) 3/6 |
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