SMTY12A datasheet(3/7 Pages) STMICROELECTRONICS

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SMTYxxA

Characteristics

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Figure 1.

Pulse waveform (10/1000 µs)

Figure 2.

Peak pulse power versus

exponential pulse duration

(Tj initial = 25° C)

Pulse waveform 10/1000 µs

tp = 10 µs

1000 µs

1.E-01

1.E+00

1.E+01

0.01

0.10

1.00

10.00

pp(kW)

j initial = 25 °C

tp(ms)

Figure 3.

Relative variation of peak pulse

power versus initial junction

temperature

Figure 4.

Average power dissipation versus

ambient temperature

100

110

100

125

150

175

Tj(°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

100

125

150

P(W)

th(j-a)=Rth(j-l)

th(j-a)=120 °C/W

(PCB FR4, recommended pad layout)

Tamb(°C)

Figure 5.

Variation of thermal impedance,

junction to ambient, versus pulse

duration (Epoxy, FR4, eCu = 35 µm)

Figure 6.

Thermal resistance, junction to

ambient, versus copper surface

under each lead (printed circuit

board FR4, eCu = 35 µm)

0.1

1.0

10.0

100.0

1000.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)(°C/W)

CU=3 mm²

Recommended pad layout

tp(s)

100

120

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

th(j-a) (°C/W)

SCU(cm²)

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