3 Pin Configuration and Functions

Figure 3-1. CD54ACT151 J Package; CD74ACT151

J, D, or PW Package; 16-Pin CDIP, SOIC or TSSOP

(Top View)

D2

D1

D0

Y

W

G

GND

D4

D5

D6

D7

A

C

B

PAD

D3

V

CC

2

3

4

5

6

7

8

15

14

13

12

11

10

9

1

16

Figure 3-2. CD74ACT151 BQB Package, 16-Pin

WQFN (Transparent Top View)

Pin Functions

PIN

I/O(1)

DESCRIPTION

NO.

NAME

1

D3

I

Data input 3

2

D2

I

Data input 2

3

D1

I

Data input 1

4

D0

I

Data input 0

5

Y

O

Data output

6

W

O

Data output, inverted

7

G

I

Output strobe, active low

8

GND

—

Ground

9

C

I

Address select C

10

B

I

Address select B

11

A

I

Address select A

12

D7

I

Data input 7

13

D6

I

Data input 6

14

D5

I

Data input 5

15

D4

I

Data input 4

16

VCC

—

Positive supply

Thermal Pad(2)

—

The thermal pad can be connected to GND or left floating. Do not connect to any other

signal or supply

(1)

I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power

(2)

BQB package only

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CD54ACT151, CD74ACT151

SCHS338B – MARCH 2003 – REVISED MAY 2025

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Product Folder Links: CD54ACT151 CD74ACT151