VN610SP

Package and PCB thermal data

Doc ID 6236

Rev 5

19/26

4

Package and PCB thermal data

4.1

PowerSO-10 thermal data

Figure 21. PowerSO-10 PC board

Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB

thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm2).

Figure 22. Rthj-amb Vs PCB copper area in open box free air condition

30

35

40

45

50

55

02

4

68

10

PCB Cu heatsink area (cm^2)

RTHj_amb (°C/W)

Tj-Tamb=50°C

Obsolete

Product(s)

- Obsolete

Product(s)