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VN7004SLH 数据表(PDF) 23 Page - STMicroelectronics |
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VN7004SLH 数据表(HTML) 23 Page - STMicroelectronics |
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23 / 35 page ![]() 5 Package and PCB thermal data 5.1 Octapak thermal data Figure 34. Octapak on two-layer PCB (2s0p to JEDEC JESD 51-5) Figure 35. Octapak on four-layer PCB (2s2p to JEDEC JESD 51-7) Table 14. PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 77 mm x 86 mm Board Material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Footprint dimension (top layer) 6.4 mm x 7 mm VN7004SLH Package and PCB thermal data DS13681 - Rev 2 page 23/35 |
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