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数据搜索系统，热门电子元器件搜索 |
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VN7007ALH 数据表(PDF) 28 Page - STMicroelectronics |
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VN7007ALH 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 36 page  Package and PCB thermal data VN7007ALH 28/36 DocID027958 Rev 2 6 Package and PCB thermal data 6.1 Octapak thermal data Figure 33: Octapak on two-layers PCB (2s0p to JEDEC JESD 51-5) Figure 34: Octapak on four-layers PCB (2s2p to JEDEC JESD 51-7) Table 15: PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 77 mm x 86 mm Board Material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Footprint dimension (top layer) 6.4 mm x 7 mm Heatsink copper area dimension (bottom layer) Footprint, 2 cm2 or 8 cm2 |
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