L9305EP datasheet(94/107 Pages) STMICROELECTRONICS

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8. No intrusion allowed inwards the leads.

9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width

to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower radius

or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch

packages.

10. Exact shape of each corner is optional.

11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

12. A1 is defined as the distance from the seating plane to the lowest point on the package body.

13. Dimensions D2 and E2 show the maximum exposed metal area on the package surface where the exposed

pad is located (if present). It includes all metal protrusions from exposed pad itself.

14. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of exposed pad which is

guaranteed to be free from resin flashes/bleeds, bordered by internal edge of inner groove.

15. The optional exposed pad is generally coincident with the top or bottom side of the package and not allowed

to protrude beyond that surface.

16. “N” is the number of terminal positions for the specified body size.

L9305

Package information

DS12774 - Rev 10

page 94/107

L9305EP 数据表(PDF) 94 Page - STMicroelectronics