2.2

Thermal data

2.2.1

Thermal resistance

Table 3. Operation junction temperature

Item

Symbol

Parameter

Value

Unit

A.001

Rthj-case(1)

Junction to case thermal resistance

8

°C/W

A.002

Rthj-PCB (2)

Junction to PCB thermal resistance

10

°C/W

A.003

Rthj-amb(3)

Junction to ambient thermal resistance

25.5

°C/W

1. Measured on the bottom.

2. Standard JEDEC 51.8.

3. Measured on four layers.

Note:

The values quoted are for PCB 77 mm x 86 mm x 1.6 mm, FR4, four layers; Cu thickness 0.070 mm

(outer layers). Cu thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter

0.3 mm +/-0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 2.2 mm x 2.9 mm.

2.2.2

Thermal protection

Table 4. Temperature threshold

Item

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

A.004

Tprot(1)

Thermal protection temperature

175

205

°C

A.005

Tprot_hyst

Thermal protection hysteresis

11

°C

A.006

TJ

Operating junction temperature

TJ

-40

175

°C

A.007

Tstg

Storage temperature

Tstg

150

°C

1. Thermal protection is guaranteed by design and characterization.

L99VR02J

Thermal data

DS14076 - Rev 1

page 6/38