2

Electrical specifications

2.1

Absolute maximum ratings

Stressing the device above the rating listed in the Table 3 may cause permanent damage to the device. These are

stress ratings only and operation of the device at these or any other conditions above those indicated in the

operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 3. Absolute maximum ratings

Symbol

Parameter

Value

Unit

VS

DC supply voltage

-0.3 to 28

V

VS

Single pulse/tmax < 400 ms “transient load dump”

40

V

VO

DC output voltage

-0.3 to 7

V

IO

DC output current

Internally limited

-

VEN

Enable input

-0.3 to 28

V

VESD HBM

VS pin vs GND, ESD HBM voltage level

±4

kV

ESD HBM voltage level

±2

kV

VESD CDM

ESD CDM voltage level (CDM AEC-Q100-011)

±500

V

ESD CDM voltage level on corner pins (CDM AEC-Q100-011)

±750

V

2.2

Thermal data

2.2.1

Thermal resistance

Table 4. Operation junction temperature

Symbol

Parameter

Value

Unit

Item

VFDFN8L

PWSSO12

Rthj-amb

Junction to ambient thermal resistance

32.5 (1)(2)

28.4 (1)(2)

°C/W

A.002

1. Rthj-amb based on a 4-layer JEDEC PCB (2S2P) test board with thermal vias (see the Figure 21 and Figure 23).

2. Measurements were performed according to JEDEC 51.2 in still air.

2.2.2

Thermal protection

Table 5. Temperature threshold

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

Item

Tprot(1)

Thermal protection temperature

-

190

-

°C

A.003

Tprot_hyst

Thermal protection hysteresis

-

5

-

°C

A.004

TJ

Operating junction temperature

TJ

-40

-

175

°C

A.005

Tstg

Storage temperature

Tstg

-

-

150

°C

A.006

1. Thermal protection is guaranteed by design and characterization.

L99VR03

Electricalspecifications

DS14803 - Rev 2

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