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3

A3

A2

A1

1

2

3

4

5

6

7

8

16

15

14

1

12

11

10

9

VOUTA

VOUTB

VREFH

VDD

VREFL

GND

VOUTC

VOUTD

A0

IOVDD

SDA

SCL

LDAC

DAC7573

ABSOLUTE MAXIMUM RATINGS

(1)

DAC7573

SLAS398 – SEPTEMBER 2003

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

PRODUCT

PACKAGE

PACKAGE

SPECIFICATION

PACKAGE

ORDERING

TRANSPORT MEDIA

DRAWING

TEMPERATURE

MARKING

NUMBER

NUMBER

RANGE

DAC7573

16-TSSOP

PW

–40

°C TO +105°C

D7573I

DAC7573IPW

90 Piece Tube

DAC7573IPWR

2000 Piece Tape and Reel

PW PACKAGE

PIN DESCRIPTIONS

(TOPVIEW)

PIN

NAME

DESCRIPTION

1

VOUTA Analog output voltage from DAC A

2

VOUTB Analog output voltage from DAC B

3

VREFH Positive reference voltage input

4

VDD

Analog voltage supply input

5

VREFL

Negative reference voltage input

Ground reference point for all circuitry on the

6

GND

part

7

VOUTC Analog output voltage from DAC C

8

VOUTD Analog output voltage from DAC D

9

LDAC

H/W synchronous VOUT update

10

SCL

Serial clock input

11

SDA

Serial data input

12

IOVDD I/O voltage supply input

13

A0

Device address select - I2C

14

A1

Device address select - I2C

15

A2

Device address select - Extended

16

A3

Device address select - Extended

VDD to GND

–0.3 V to +6 V

Digital input voltage to GND

–0.3 V to VDD + 0.3 V

VOUT to GND

–0.3 V to VDD + 0.3 V

Operating temperature range

–40

°C to +105°C

Storage temperature range

–65

°C to +150°C

Junction temperature range (TJ max)

+150

°C

Power dissipation:

Thermal impedance (

ΘJA)

161

°C/W

Thermal impedance (

ΘJC)

29

°C/W

Lead temperature, soldering:

Vapor phase (60s)

215

°C

Infrared (15s)

220

°C

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

2