6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Vs

Supply Voltage

–0.3

22

V

Analog Inputs,

VIN+, VIN– (2)

Differential (VIN+) – (VIN–)

–30

30

V

Common - mode

–20

122

V

Output

GND – 0.3

Vs + 0.3

V

TA

Operating Temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the VIN+ and VIN– pins, respectively.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range(1)

VS

48

120

V

VS

Operating supply range

2.7

5

20

V

TA

Ambient temperature

–40

125

°C

(1)

Common-mode voltage can go below VS under certain conditions. See Figure 7-1 for additional infromation on operating range.

6.4 Thermal Information

THERMAL METRIC(1)

INA280

UNIT

DCK (SC-70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

191.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

144.4

°C/W

RθJB

Junction-to-board thermal resistance

69.2

°C/W

ΨJT

Junction-to-top characterization parameter

46.2

°C/W

ΨJB

Junction-to-board characterization parameter

69.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA280

SBOSA19 – OCTOBER 2020

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