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EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

(.217)

[5.5]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

8X (.055)

[1.4]

8X (.024)

[0.6]

6X (.050 )

[1.27]

(R.002 )

[0.05]

TYP

SOIC - 1.75 mm max height

D0008B

SMALL OUTLINE INTEGRATED CIRCUIT

4221445/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSDE

METAL

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

EXPOSED

METAL

EXPOSED METAL SHOWN

LAND PATTERN EXAMPLE

SCALE:6X

SYMM

1

4

5

8

SEE

DETAILS

IPC-7351 NOMINAL

.150 [3.85] CLEARANCE / CREEPAGE

SYMM

HV / ISOLATION OPTION

.162 [4.1] CLEARANCE / CREEPAGE

SYMM

1

4

5

8

SEE

DETAILS

SYMM

ISO7710

SLLSER9E – NOVEMBER 2016 – REVISED DECEMBER 2024

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