5.4 Thermal Information

THERMAL METRIC(1)

ISO773x

UNIT

DW (SOIC)

DBQ (QSOP)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

81.4

109

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

44.9

46.8

°C/W

RθJB

Junction-to-board thermal resistance

45.9

60.6

°C/W

ψJT

Junction-to-top characterization parameter

28.1

35.9

°C/W

ψJB

Junction-to-board characterization parameter

45.5

60

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7730

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, input a 50-MHz 50% duty cycle

square wave

160

mW

PD1

Maximum power dissipation (side-1)

30

mW

PD2

Maximum power dissipation (side-2)

130

mW

ISO7731

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, input a 50-MHz 50% duty cycle

square wave

160

mW

PD1

Maximum power dissipation (side-1)

60

mW

PD2

Maximum power dissipation (side-2)

100

mW

ISO7730, ISO7731

SLLSES0K – SEPTEMBER 2016 – REVISED SEPTEMBER 2025

www.ti.com

6

Submit Document Feedback

Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: ISO7730 ISO7731