Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the

consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No

license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned

in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.

SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express

written approval of SGS-THOMSON Microelectronics.

© 1995 SGS-THOMSON Microelectronics - All rights reserved.

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Cooling method by convection and conduction

Marking : type number

Weight : 0.15 g

PACKAGE MECHANICAL DATA (in millimeters)

DO 35 Glass

Polarity : N A

Stud torque : N A

note 2

BA

B

C

note 1

note 1

D

D

O

/

O

/

O

/

E

E

REF.

DIMENSIONS

NOTES

Millimeters

Inches

Min.

Max.

Min.

Max.

A

3.050

4.500

0.120

0.117

1 - The lead diameter

∅ D is not controlled over zone E

2 - The minimum axial lengh within which the device may be

placed with its leads bent at right angles is 0.59”(15 mm)

B

12.7

0.500

∅ C

1.530

2.000

0.060

0.079

∅ D

0.458

0.558

0.018

0.022

E

1.27

0.050

®

DB3 / DB4 / DC34

4/4