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December 1999

D10, D15, D20, D22, C20, C30

MICROMODULES

Memory Micromodules

General Information for D1, D2 and C Packaging

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Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

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The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

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Physical dimensions and contact positions

compliant to the ISO 7816 standard

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Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

DESCRIPTION

Memory Cards consist of two main parts: the

plastic card, and the embedded Micromodule

(which, in turn, carries the silicon chip).

The plastic card is made of PVC, ABS or similar

material, and can be over-printed with graphics,

text, and magnetic strips. The Micromodule is

embedded in a cavity in the plastic card.

The Micromodules are mounted on Super 35 mm

metallized epoxy tape, and are delivered on reels.

These contain all of the chips from a number of

wafers, including those chips that were found to be

non-functioning during testing. Traceability is

ensured by a label fixed on the reel.

D10

D20

potting side

contact side

D15

D22

C30

C20

Table 1. Memory Card and Memory Tag Integrated Circuits

Modul e

Please see the data briefing sheets of these products for example illustrations of these

micromodules

D10

ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355

D15

ST14C02, ST1305B, ST1335, ST1336, ST1355

D20

ST14C02, M14C04, M14C16, M14C32

D22

M14C64, M14128, M14256

C30

M35101, M35102

C20

M35101, M35102