Figure 7. Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

10

100

1

1 0

100

F=1 MHz

VOSC=30 mVRMS

Tj=25 °C

V (V)

R

Figure 8. Forward voltage drop versus forward current

(maximum values)

I

(A)

FM

0.01

0.10

1.00

10.00

100.00

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Tj=25 °C

Tj=125 °C

V

(V)

FM

Figure 9. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy printed ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 10. Thermal resistance junction to ambient versus

copper surface under each lead (SMA)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

STPS1H100-Y

Characteristics (curves)

DS6946 - Rev 2

page 4/11