STPS1L40AY datasheet(4/13 Pages) STMICROELECTRONICS

4 / 13 page

Characteristics

STPS1L40-Y

4/13

DocID018247 Rev 2

Figure 7: Relative variation of thermal impedance

junction to ambient versus pulse duration

Figure 8: Relative variation of thermal impedance

junction to lead versus pulse duration

Figure 9: Reverse leakage current versus reverse

voltage applied (typical values)

Figure 10: Junction capacitance versus reverse

voltage applied (typical values)

Figure 11: Forward voltage drop versus forward

current (typical values)

Figure 12: Thermal resistance junction to ambient

versus copper surface under each lead

(typical values)

Zth(j-a)/Rth(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

SMB

tP(s)

Single pulse

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SOD123Flat

Zth(j-l)/Rth(j-l)

tp(s)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

j = 150 °C

j = 125 °C

j = 25 °C

j = 100 °C

j = 75 °C

j = 50 °C

IR(mA)

VR(V)

100

1000

100

F = 1 MHz

OSC = 30 mVRMS

j = 25 °C

C(pF)

VR(V)

Rth(j-a)(°C/W)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMA

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

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