8 Device and Documentation Support

8.1 Device Nomenclature

Table 8-1. Available Options

PRODUCT(1)

VOUT

LP2992vwxxy-z.z/NOPB

v is the accuracy specification for the legacy chip (A or blank). See the Electrical

Characteristics for more information. This character is insignificant for the new chip. w is

the operating temperature range (I = −40°C to +125°C). xx is the package designator.

y is the reel designator size. See the Package Addendum for more information on

package quantity.

z.z is the nominal output voltage (for example, 3.3 = 3.3V; 5.0 = 5.0V). /NOPB indicates

material construction that does not use Lead (Pb).

This device ships with the legacy chip (CSO: DLN or GF8) or the new chip (CSO:

RFB), which uses the latest manufacturing flow. The reel packaging label provides CSO

information to distinguish which chip is used. Device performance for new and legacy

chips is denoted throughout the document.

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

8.2 Documentation Support

8.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, AN-1187 Leadless Leadframe Package (LLP), application note

• Texas Instruments, Semiconductor and IC Package Thermal Metrics, application note

• Texas Instruments, Using New Thermal Metrics, application note

• Texas Instruments, Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs,

application note

8.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

8.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

www.ti.com

LP2992

SNVS171L – NOVEMBER 2001 – REVISED FEBRUARY 2025

Copyright © 2025 Texas Instruments Incorporated

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Product Folder Links: LP2992