3312 - 2 mm SMD Trimming Potentiometer

CRF Series - High Power Current Sense Chip Resistor

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

REV. 08/25

D0 DIA.

1.5

(0.059)

DIA. MIN.

t

A

P1

P2

P0

B

E

F

W

TOP TAPE

EMBOSSED TAPE

RESISTOR

USER DIRECTION OF FEED

60.0

(2.362)

MIN.

DIA.

DIA.

180 +0/-3

(7.09 +0/-0.118)

13.0 ± 1.0

(0.512 ± 0.039)

DIA.

15.4 ± 2.0

(0.606 ± 0.079)

13.0 ± 1.0

(0.512 ± 0.039)

Packaging Dimensions (Conforms to EIA RS-481A)

3.60 ± 0.20

(0.142 ± 0.008)

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.05

(0.157 ± 0.002)

4.0 ± 0.1

(0.157 ± 0.004)

1.5 +0.1/-0

(0.059 +0.004/-0) DIA.

1.5

(0.059)

DIA. MIN.

0.85 ± 0.15

(0.033 ± 0.006)

6.9 ± 0.2

(0.272 ± 0.008)

5.5 ± 0.05

(0.217 ± 0.002)

1.75 ± 0.1

(0.069 ± 0.004)

12.0 ± 0.2

(0.472 ± 0.008)

TOP TAPE

EMBOSSED TAPE

RESISTOR

USER DIRECTION OF FEED

60.0

(2.362)

MIN.

DIA.

DIA.

180 +0/-3

(7.09 +0/-0.118)

13.0 ± 1.0

(0.512 ± 0.039)

DIA.

15.4 ± 2.0

(0.606 ± 0.079)

13.0 ± 1.0

(0.512 ± 0.039)

DIMENSIONS:

MM

(INCHES)

Packing Model

A

B

W

F

E

P1

P2

P0

D0

t

Paper

Tape

CRF0805

1.6 ± 0.15

(0.063 ± 0.006)

2.4 ± 0.20

(0.094 ± 0.008)

8.0 ± 0.20

(0.315 ± 0.008)

3.5 ± 0.05

(0.138 ± 0.002)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.1

(0.079 ± 0.004)

4.0 ± 0.1

(0.157 ± 0.004)

1.5+0.1/-0

(0.059+0.004/-0)

0.84 ± 0.10

(0.033 ± 0.004)

Paper

Tape

CRF1206

2.0 ± 0.15

(0.079 ± 0.006)

3.6 ± 0.20

(0.142 ± 0.008)

8.0 ± 0.20

(0.315 ± 0.008)

3.5 ± 0.05

(0.138 ± 0.002)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.05

(0.157 ± 0.002)

1.5+0.1/-0

(0.059+0.004/-0)

0.85 ± 0.15

(0.033 ± 0.006)

Embossed

Tape

CR2010

2.80 ± 0.20

(0.110 ± 0.008)

5.3 ± 0.20

(0.209 ± 0.008)

12.0 ± 0.20

(0.472 ± 0.008)

5.5 ± 0.05

(0.217 ± 0.002)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.05

(0.157 ± 0.002)

1.5+0.1/-0

(0.059+0.004/-0)

0.85 ± 0.15

(0.033 ± 0.006)

Embossed

Tape

CRF2512

3.60 ± 0.20

(0.142 ± 0.008)

6.9 ± 0.20

(0.272 ± 0.008)

12.0 ± 0.20

(0.472 ± 0.008)

5.5 ± 0.05

(0.217 ± 0.002)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.05

(0.157 ± 0.002)

1.5+0.1/-0

(0.059+0.004/-0)

1.20 ± 0.15

(0.047 ± 0.006)

Soldering Profile

TIME

tL

TIME 25 °C TO PEAK

tp

ts

Tsmax

Tsmin

Tp

TL

25

Tc -5 °C

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/s

MAX. RAMP DOWN RATE = 6 °C/s

Profile Feature

Pb-Free Assembly

Preheat / Soak:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (ts) from (Tsmin to Tsmax)

150 °C

200 °C

60~120 seconds

Ramp Up Rate (TL to Tp)

3 °C / second max.

Liquidous Temperature (TL)

Time (tL) maintained above TL

217 °C

60~150 seconds

Peak Package Body

Temperature (Tp)

260 °C

Time within 5 °C of actual peak

temperature (Tp)

20~30 seconds*

Ramp Down Rate (Tp to TL)

6 °C / second max.

Time 25 °C to Peak Temperature

8 minutes max.

* Tolerance for peak profile temperature (Tp ) is defined as a

supplier minimum and a user maximum.