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MF-FSMF035X 数据表(PDF) 3 Page - Bourns Electronic Solutions |
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MF-FSMF035X 数据表(HTML) 3 Page - Bourns Electronic Solutions |
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3 / 7 page ![]() MF-FSMF Series - PTC Resettable Fuses “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. How To Order MF - FSMF 020 X - 2 Multifuse® Product Designator Series FSMF = 0603 Surface Mount Component Hold Current, Ihold 010-050 (0.10 - 0.50 Amps) Multifuse® freeXpansion™ Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel Typical Part Marking PART IDENTIFICATION: MF-FSMF010X = II MF-FSMF020X = I MF-FSMF025X = + MF-FSMF035X = • MF-FSMF050X = — BI-WEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z Packaging Quantity Model Packaging Quantity MF-FSMF010X 5,000 pcs. per reel MF-FSMF020X 6,000 pcs. per reel MF-FSMF025X 6,000 pcs. per reel MF-FSMF035X 6,000 pcs. per reel MF-FSMF050X 4,000 pcs. per reel Solder Reflow Recommendations Notes: • MF-FSMF models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. • Hand soldering is not recommended for these devices. • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. TP TP tp t s TTO RAMP-UP L TL t L 25 Ts max Ts min PREHEAT Time CRITICAL ZONE RAMP-DOWN t 25 °C TO PEAK Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200 °C 60~180 seconds TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) 217 °C 60~150 seconds Peak Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. |
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