ABRACON IS

ISO9001-2015

CERTIFIED

Hidden Creek Ln Spicewood TX 78669

5101

Phone: 512-371-6159 | Fax: 512-351-8858

REVISED: 11-26-24

For terms and conditions of sales, please visit:

www.abracon.com

Dual-Band Wi-Fi LTCC RF Diplexer

ADID-R-0015

1.6 x 0.8 x 0.6 mm

RoHS Compliant

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Reflow Profile [JEDEC J-STD-020]

Solder paste: Sn/3.0Ag/0.5Cu

Profile Feature

Sn-Pb Eutectic

Assembly

Pb-Free Assembly

Preheat / soak

Temperature minimum (Tsmin)

00℃

50℃

Temperature maximum (Tsmax)

50℃

00℃

Time (Tsmin to Tsmax) (ts)

60 –

0 sec.

60 – 90 sec.

Average ramp-up rate (Tsmax to Tp)

℃/sec. max

℃/sec. max

Liquidous temperature (TL)

8 ℃

7℃

Time at Liquidous (TL)

60 – 50 sec.

60 – 50 sec.

Peak package body temperature (Tp)*

See Table 1

See Table 2

Time (Tp)** within 5℃ of the specified classification temperature (Tc)

0 sec.

0 sec.

Ramp-down rate (Tp to Tsmax)

6℃/sec. max

6℃/sec. max

Time 5℃ to peak temperature

6 min. max

8 min. max

Reflow cycles

max

max

*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

**Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1

SnPb Eutectic Process

Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

≧

350

<2.5mm

235℃

220℃

≧

2.5mm

220℃

220℃

Table 2

Pb-Free Process

Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

350-2000

Volume mm3

>2000

< .6mm

60℃

60℃

60℃

.6mm - .5mm

60℃

50℃

45℃

> .5mm

50℃

45℃

45℃