1.1

Characteristics (curves)

Figure 1. Average forward current versus lead

temperature (δ = 0.5)

0

1

2

3

4

5

6

7

8

9

0

25

50

75

100

125

150

175

IF(AV)(A)

T

L(°C)

T

=tp/T

tp

SMA

SOD128Flat

SMB

Figure 2. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMA)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

SMA

Z

th(j-a) / Rth(j-a)

t

p(s)

Figure 3. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMB)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z

th(j-a) / Rth(j-a)

t

p(s)

Single pulse

SMB

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration (SOD128Flat)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Z

th(j-l) / Rth(j-l)

t

p(s)

Single pulse

SOD128Flat

Figure 5. Reverse leakage current versus reverse voltage

applied (typical values)

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

0

10

20

30

40

50

60

70

80

90

100

VR(V)

IR(µA)

Tj = 150 °C

Tj = 25 °C

Tj = 100 °C

Tj = 75 °C

Tj = 50 °C

Tj = 125 °C

Figure 6. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

10

100

C(pF)

F = 1 MHz

V

osc= 30 mVRMS

T

j = 25 °C

VR(V)

STPS2H100-Y

Characteristics (curves)

DS6949 - Rev 2

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