Figure 11. Forward voltage drop versus forward current

(high level)

0.1

1.0

10.0

0.0

0.1

0.4

0.5

0.6

0.7

0.2

0.3

Tj=25°C

(maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(maximum values)

Tj=125°C

Tj=125°C

(typical values)

IF(A)

VF(V)

Figure 12. Forward voltage drop versus forward current

(low level)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Tj=25°C

(maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(maximum values)

Tj=125°C

Tj=125°C

(typical values)

IF(A)

VF(V)

Figure 13. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (SMB flat)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

SMB flat

Epoxy printed circuit board FR4, e

Cu = 35 µm

Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA

Flat Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

SMA Flat

STPS2L40

Characteristics (curves)

DS2146 - Rev 6

page 6/17