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LP8556

SNVS871M – JULY 2012 – REVISED JUNE 2020

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Copyright © 2012–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Options....................................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 6

7.1

Absolute Maximum Ratings ...................................... 6

7.2

ESD Ratings.............................................................. 6

7.3

Recommended Operating Conditions ....................... 6

7.4

Thermal Information .................................................. 7

7.5

Electrical Characteristics........................................... 7

7.6

Electrical Characteristics — Boost Converter .......... 8

7.7

Electrical Characteristics — LED Driver ................... 9

7.8

Electrical Characteristics — PWM Interface ............. 9

7.9

Electrical Characteristics — Logic Interface .......... 10

7.10

I2C Serial Bus Timing Parameters (SDA, SCL) .... 10

7.11

Typical Characteristics .......................................... 11

8

Detailed Description ............................................ 12

8.1

Overview ................................................................. 12

8.2

Functional Block Diagram ....................................... 12

8.3

Feature Description................................................. 13

8.4

Device Functional Modes........................................ 28

8.5

Programming........................................................... 28

8.6

Register Maps ......................................................... 32

9

Application and Implementation ........................ 45

9.1

Application Information............................................ 45

9.2

Typical Application ................................................. 47

10

Power Supply Recommendations ..................... 51

11

Layout................................................................... 51

11.1

Layout Guidelines ................................................. 51

11.2

Layout Examples................................................... 52

12

Device and Documentation Support ................. 54

12.1

Receiving Notification of Documentation Updates 54

12.2

Community Resources.......................................... 54

12.3

Trademarks ........................................................... 54

12.4

Electrostatic Discharge Caution ............................ 54

12.5

Glossary ................................................................ 54

13

Mechanical, Packaging, and Orderable

Information ........................................................... 54

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision L (May 2019) to Revision M

Page

•

Changed Description statement for clarification at Register CFG9E .................................................................................. 38

Changes from Revision K (March 2019) to Revision L

Page

•

Deleted 03H register from Table 9 ....................................................................................................................................... 32

•

Deleted 8.6.1.4 Identification section from the Register Bit Explanations............................................................................ 33

Changes from Revision J (January 2018) to Revision K

Page

•

Added separate ESD Rating for the WQFN package - changed from "±2000" to "±1000".................................................... 6

Changes from Revision I (March 2016) to Revision J

Page

•

Added content in VBOOST_RANGE description of CFG9E ................................................................................................ 38

Changes from Revision H (December 2014) to Revision I

Page

•

Changed "25 mA" to "23 mA" - E00, E08 and E09 SQ rows, E09, E11 TME rows ............................................................... 3

•

Changed Handing Ratings table to ESD Ratings .................................................................................................................. 6

•

Added updated Thermal Information ..................................................................................................................................... 7

•

Changed "8" to "10" in PWMres row ...................................................................................................................................... 9

•

Changed subtracted 1 from bit value of all Table 4 "ƒPWM [Hz] (Resolution)" entries ......................................................... 20

•

Changed subtracted 1 from bit value of all Table 5 "ƒPWM [Hz] (Resolution)" entries except 2402 .................................... 21

•

Changed subtracted 1 from bit value of all Table 11 "ƒPWM [Hz] (Resolution)" entries ....................................................... 45