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STM32F031F4 数据表(PDF) 97 Page - STMicroelectronics |
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STM32F031F4 数据表(HTML) 97 Page - STMicroelectronics |
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97 / 106 page  DocID025743 Rev 6 97/106 STM32F031x4 STM32F031x6 Package information 102 Figure 47. Recommended footprint for TSSOP20 package 1. Dimensions are expressed in millimeters. k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 67. TSSOP20 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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