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ESDAXXL 数据表(PDF) 2 Page - STMicroelectronics |
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ESDAXXL 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 6 page ![]() ESDAxxL 2/6 Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient C Capacitance Rd Dynamic resistance VF Forward voltage drop ELECTRICAL CHARACTERISTICS (Tamb = 25°C) I IF V F VBR VRM I PP I RM V 1 Rd Slope: Symbol Parameter Value Unit VPP Electrostatic discharge MIL STD 883C - Method 3015-6 IEC61000-4-2 air discharge IEC61000-4-2 contact discharge 25 16 9 kV PPP Peak pulse power (8/20 µs) 300 W Tstg Tj Storage temperature range Maximum junction temperature -55to+150 150 °C °C TL Maximum lead temperature for soldering during 10s 260 °C Top Operating temperature range -40to+125 °C note 1: Evolution of functional parameters is given by curves. ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Types VBR @ IR IRM @VRM Rd αTC VF @IF min. max. max. typ. max. typ. max. note 1 note 2 0V bias VV mA µAV m Ω 10 -4/ ⊃CpF V mA ESDA5V3L 5.3 5.9 1 2 3 280 5 220 1.25 200 ESDA6V1L 6.1 7.2 1 20 5.25 350 6 140 1.25 200 ESDA14V2L 14.2 15.8 1 5 12 650 10 90 1.25 200 ESDA25L 25 30 1 1 24 1000 10 50 1.2 10 note 1 : Square pulse Ipp = 15A, tp=2.5 µs. note 2 : ∆ VBR = αT* (Tamb -25°C) * VBR (25°C) |
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