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STM32F031F4P6 数据表(PDF) 94 Page - STMicroelectronics |
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STM32F031F4P6 数据表(HTML) 94 Page - STMicroelectronics |
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94 / 106 page  Package information STM32F031x4 STM32F031x6 94/106 DocID025743 Rev 6 Figure 44. Recommended footprint for WLCSP25 package aaa - 0.100 - - 0.0039 - bbb - 0.100 - - 0.0039 - ccc - 0.100 - - 0.0039 - ddd - 0.050 - - 0.0020 - eee - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 4. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 66. WLCSP25 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 65. WLCSP25 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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