Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-R Series Tape and Reel Specifications

Devices taped using EIA-468/IEC 60286-2 standards. See table below and figures for details.

Dimension Description

IEC

Mark

EIA

Mark

Dimensions

Tolerance

Carrier tape width

W

W

18

(.709)

+1.0/-0.5

(+.039/-.020)

Hold down tape width

W0

W0

5

(.197)

min.

Hold down tape

No protrusion

Adhesive tape position

W2

W2

3

(.118)

max.

Sprocket hole position

W1

W1

9

(.354)

+0.75/-0.5

(+.030/-.020)

Sprocket hole diameter

D0

D0

4

(.157)

±0.2

(±.0078)

Height to seating plane (straight lead)

H

H

18 ~ 20

(.709 ~ .787)

Height to seating plane (formed lead)

H0

H0

16

(.630)

±0.5

(±.020)

Overall height above abscissa: MF-R700

H1

H1

41

(1.61)

max.

Overall height above abscissa: all other models

H1

H1

38.5

(1.516)

max.

Cutout length

L

11

(.433)

max.

Sprocket hole pitch: MF-R005 ~ MF-R400

P0

P0

12.7

(.500)

±0.3

(±.012)

Sprocket hole pitch: MF-R500 ~ MF-R1100

P0

P0

30

(1.18)

±0.6

(±.024)

Device pitch: MF-R005 ~ MF-R185

P

P

12.7

(.500)

±0.3

(±.012)

Device pitch: MF-R250 ~ MF-R400

P

P

25.4

(1.00)

±0.6

(±.024)

Device pitch: MF-R500 ~ MF-R1100

P

P

30

(1.18)

±0.6

(±.024)

Pitch tolerance

20 consecutive

±1

(±.039)

Composite tape thickness

t

t

0.9

(.035)

max.

Overall tape and lead thickness: MF-R005 ~ MF-R185

t1

t1

2.0

(.079)

max.

Overall tape and lead thickness: MF-R250 ~ MF-R1100

t1

t1

2.3

(.091)

max.

Splice sprocket hole alignment

0

±0.3

(±.012)

Front-to-back deviation

Δh

Δh

0

±1.0

(±.039)

Side-to-side deviation

Δp

Δp

0

±1.3

(±.051)

Ordinate to adjacent component lead: MF-R005 ~ MF-R400

P1

P1

3.81

(.150)

±0.7

(±.028)

Ordinate to adjacent component lead: MF-R500 ~ MF-R1100

P1

P1

9.9

(.390)

±0.7

(±.028)

Lead spacing: MF-R005 ~ MF-R400

F

F

5.08

(.200)

+0.6/-0.2

(+.024/-.008)

Lead spacing: MF-R500 ~ MF-R1100

F

F

10.2

(.400)

+0.6/-0.2

(+.024/-.008)

DIMENSIONS:

MM

(INCHES)

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