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MUX506, MUX507

SBAS803A – NOVEMBER 2016 – REVISED NOVEMBER 2017

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Copyright © 2016–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 6

6.1

Absolute Maximum Ratings ...................................... 6

6.2

ESD Ratings.............................................................. 6

6.3

Recommended Operating Conditions ....................... 6

6.4

Thermal Information .................................................. 7

6.5

Electrical Characteristics: Dual Supply ..................... 7

6.6

Electrical Characteristics: Single Supply................... 9

6.7

Typical Characteristics ............................................ 11

7

Parameter Measurement Information ................ 16

7.1

Truth Tables ............................................................ 16

7.2

On-Resistance ........................................................ 17

7.3

Off Leakage............................................................. 17

7.4

On-Leakage Current ............................................... 18

7.5

Transition Time ....................................................... 18

7.6

Break-Before-Make Delay....................................... 19

7.7

Turn-On and Turn-Off Time .................................... 20

7.8

Charge Injection ...................................................... 21

7.9

Off Isolation ............................................................. 22

7.10

Channel-to-Channel Crosstalk .............................. 22

7.11

Bandwidth ............................................................. 23

7.12

THD + Noise ......................................................... 23

8

Detailed Description ............................................ 24

8.1

Overview ................................................................. 24

8.2

Functional Block Diagram ....................................... 24

8.3

Feature Description................................................. 25

8.4

Device Functional Modes........................................ 27

9

Application and Implementation ........................ 28

9.1

Application Information............................................ 28

9.2

Typical Application ................................................. 28

10

Power Supply Recommendations ..................... 30

11

Layout................................................................... 31

11.1

Layout Guidelines ................................................. 31

11.2

Layout Example .................................................... 31

12

Device and Documentation Support ................. 33

12.1

Documentation Support ........................................ 33

12.2

Related Links ........................................................ 33

12.3

Receiving Notification of Documentation Updates 33

12.4

Community Resources.......................................... 33

12.5

Trademarks ........................................................... 33

12.6

Electrostatic Discharge Caution ............................ 33

12.7

Glossary ................................................................ 33

13

Mechanical, Packaging, and Orderable

Information ........................................................... 34

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (November 2016) to Revision A

Page

•

Changed Transition Time From: 85 ns To: 97ns (Typ) in the Features list............................................................................ 1

•

Added SOIC packages to Feature and Device Information .................................................................................................. 1

•

Added the DW (SOIC) package to the Pin Configuration and Functions section .................................................................. 3

•

Added SOIC package to the Thermal Information table ........................................................................................................ 7

•

Changed Transition time Typ value From 85: ns To: 97ns for ±15 V supplies in the Electrical Characteristics: Dual

Supply table ............................................................................................................................................................................ 8

•

Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for ±15

V supplies in Electrical Characteristics: Dual Supply ............................................................................................................. 8

•

Changed Transition time Typ value From: 91 To: 102 ns for 12 V supply in the Electrical Characteristics: Single

Supply table .......................................................................................................................................................................... 10

•

Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for 12 V

supply in Electrical Characteristics: Single Supply ............................................................................................................... 10

•

Added NOTE to the Application and Implementation section .............................................................................................. 28