5.4 Thermal Information OPA397

THERMAL METRIC(1)

OPA397

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

187.1

220.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

107.4

124.4

°C/W

RθJB

Junction-to-board thermal resistance

57.5

72.9

°C/W

ΨJT

Junction-to-top characterization parameter

33.5

46.1

°C/W

ΨJB

Junction-to-board characterization parameter

57.1

72.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information OPA2397

THERMAL METRIC(1)

OPA2397

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

131.7

165

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

71.4

53

°C/W

RθJB

Junction-to-board thermal resistance

75.2

87

°C/W

ΨJT

Junction-to-top characterization parameter

21.8

4.9

°C/W

ΨJB

Junction-to-board characterization parameter

74.4

85

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Thermal Information OPA4397

THERMAL METRIC(1)

OPA4397

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

109.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

27.4

°C/W

RθJB

Junction-to-board thermal resistance

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.5

°C/W

ΨJB

Junction-to-board characterization parameter

54.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA397, OPA2397, OPA4397

SBOSA02A – AUGUST 2021 – REVISED APRIL 2025

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